From rapid NPI prototyping to high-volume PCBA production — Micronix SMT Solutions bridges design and reality with cutting-edge Surface Mount Technology and full turnkey assembly services.
Leading OEMs and product companies across India trust Micronix SMT Solutions to manufacture their most critical electronic assemblies — on time, every time.
Micronix SMT Solutions is a full-spectrum Electronics Manufacturing Services (EMS) company specialising in PCBA, THT assembly, box-build, and turnkey system integration. We partner with OEMs across six critical industries to deliver precision-engineered assemblies.
From bare PCB to boxed product — every stage handled in-house with precision machinery, quality gates, and engineering expertise.
High-speed surface mount component placement using Fuji Pick & Place machines at 25,000 CPH with 0.1mm fine-pitch precision on multi-layer PCBs.
Through-hole technology assembly for high-power components, axial/radial lead parts, and mixed-technology boards requiring both SMT and THT processes.
Complete turnkey assembly including mechanical housing, cable harnessing, potting, cabinet integration, and firmware flashing for a finished product.
Rapid New Product Introduction services from CAD data to functional hardware with full engineering DFM review — fast-tracked without quality compromise.
Automated Optical Inspection for every solder joint, combined with In-Circuit Testing for full electrical validation to IPC-A-610 Class II/III standards.
Full lifecycle services including board-level repair, component refurbishment, product upgrades, and supply chain management for extended product life.
Every board follows a rigorously controlled manufacturing sequence. Quality inspection gates are built into every critical stage — nothing moves forward until it passes.
A fully integrated SMT production line — each machine selected for speed, precision, and repeatability across complex, multi-layer assemblies.
Stencil-based paste deposition with dual squeegee heads, automated 2D/3D SPI, and inline fiducial alignment. Delivers consistent paste volumes on every pad for optimal joint formation.
Auto & Semi-Auto Variants
Networked dual-machine LAN setup running simultaneously on the same job. CAD-data driven, with image-processing component verification and real-time Fuji Flexa recipe display.
25,000 CPH Capacity
Multi-zone tunnel oven with precision thermal profiling. Supports lead-free and leaded solder profiles with fan-assisted convection for uniform temperature across the entire board surface.
Multi-Zone Thermal Profiling
Multi-camera Automated Optical Inspection scanning every solder joint against IPC guidelines. Detects missing components, bridges, lifted leads, tombstoning, and volume deviations reliably.
IPC-Compliant Non-ContactWe adapt our SMT machinery and quality protocols to meet the unique environmental, safety, and regulatory demands of each vertical.
High-power PCBA for EV charging stations and renewable energy management systems — extreme thermal stability and high-current reliability required.
High-reliability assemblies for satellite communication arrays, built to withstand vacuum, radiation, and extreme thermal cycling environments.
Safety-critical control systems and communication boards designed for long-lifecycle reliability in high-vibration, harsh railway environments.
High-speed digital and RF assemblies for modern network infrastructure, 5G edge nodes, data centres, and global connectivity hardware.
Miniaturised, low-power assemblies for smart appliances, IoT sensors, water purifiers, UPS systems, and home automation controllers.
Versatile manufacturing for power tools, home appliances, consumer gadgets, and industrial controls — cost-optimised for volume production runs.
From rapid NPI prototypes to full-volume production runs — here is a snapshot of the kinds of projects we successfully deliver.
High-current 6-layer PCBA for a 30kW DC fast charger — thermal management critical, zero field failures reported post-deployment.
Mission-critical onboard navigation and HMI communication PCBs for rail systems — built for 10-year lifecycle with vibration-resistant assembly.
High-reliability RF and digital assemblies for satellite communication arrays — IPC Class III, radiation-tolerant component selection and placement.
Miniaturised IoT hub PCBA with BLE and Wi-Fi modules — fine-pitch 0201 components, low-power design, scaled from 50-unit NPI to 5,000/month production.
A clear 4-step engagement model — transparent communication, no surprises, on-time delivery every run.
Submit Gerber files, BOM, and CAD data. Our engineers perform a full Design For Manufacturability review to maximise yield before production starts.
Receive a transparent quote covering materials, machine time, testing, and lead time. Production is scheduled around your delivery requirements.
Boards enter the SMT line through quality-gated stages: SPI, AOI post-placement, post-reflow inspection, and final ICT functional test.
Assemblies are cleaned, labelled, packed in ESD-safe materials, and dispatched with full traceability documentation and test reports included.
Every assembly leaving our facility is backed by a multi-stage quality protocol combining IPC-A-610 standards, automated optical inspection, and manual verification for consistently defect-free outputs.
All assemblies produced and inspected per IPC-A-610 Class II/III — the globally accepted benchmark for electronic assembly acceptability and workmanship.
Post-reflow AOI scans every joint — detecting solder bridges, insufficient solder, misalignment, missing components, and lifted leads with high-resolution cameras.
Electrical validation ensures every net is connected, every component is functional, and the board performs to specification before it leaves our facility.
Early-stage DFM review catches design issues before they become production defects — improving first-pass yield and reducing your overall programme cost significantly.
Our manufacturing processes and quality systems are aligned with internationally recognised standards — giving you confidence in every board we ship.
ISO 9001 aligned quality management — systematic process control, continuous improvement, and documented quality assurance at every production stage.
The globally accepted standard for electronic assembly quality. Our inspectors and processes are aligned to IPC-A-610 Class II & Class III workmanship criteria.
Restriction of Hazardous Substances compliant — lead-free soldering processes, halogen-free material options, and full environmental compliance for global markets.
Full ESD protection throughout the facility — ESD flooring, wrist straps, ionisers, ESD-safe packaging, and humidity-controlled storage for sensitive components.
Materials and processes aligned with EU REACH regulation for chemical substance restrictions — required for export to European and global markets.
IPC J-STD-001 compliant soldering processes — covering solder material, flux usage, heat application, and joint quality for both SMT and through-hole assembly.
A look inside the Micronix SMT Solutions production floor — where every board is built with precision machinery and rigorous quality control.
Get instant answers on your PCBA requirements, request a quote, or send your BOM directly. Our team responds within minutes during business hours.
Share your Gerber files, BOM, and requirements. Our team will respond with a DFM review and competitive quote within 24 hours.
Send us your design files for immediate DFM review — we'll identify any manufacturability issues before production begins.
Receive a detailed, itemised quote with pricing, lead time, and DFM feedback within one business day of submission.
Your design IP is always protected. We offer mutual NDA agreements before reviewing any proprietary design files.
Strategically located in India for cost-competitive EMS with IPC-certified quality standards and on-time delivery.
Strategically located in India for efficient logistics, cost-competitive production, and rapid turnaround for OEM clients nationwide.